Welcome to the official website of the 2019 2nd International Conference on Smart Materials Applications (ICSMA 2019) will take place in Tokyo, Japan during January 19-22, 2019. The conference program covered invited, oral, and poster presentations from scientists working in similar areas to establish platforms for collaborative research projects in this field. This conference will bring together leaders from industry and academia to exchange and share their experiences, present research results, explore collaborations and to spark new ideas, with the aim of developing new projects and exploiting new technology in this field.
ICSMA provides a forum for accessing to the most up-to-date and authoritative knowledge from both industrial and academic worlds, sharing best practice in the field of smart materials Analysis. The meeting will provide an opportunity to highlight recent developments and to identify emerging and future areas of growth in this exciting field.
Acceptance Notice: 05-November-2018
Registration Due: 25-November-2018
Conference dates: 19-22-January-2019.
All submissions will be peer reviewed, the registered and presented papers will be published into IOP Conference Series: Materials Science and Engineering (Online ISSN: 1757-899X; Print ISSN: 1757-8981), which is indexed by Ei Compendex, Scopus, Thomson Reuters (WoS), Inspec,et al.
Submission deadline of ICSMA2019 has been extended to October 15! ---- Sept. 06th, 2018
Welcome Prof. Jong Hak Kim from Yonsei University, South Korea give Keynote Speech at conference! (Read More)---- Jun. 22th, 2018
Welcome Prof. Shu YIN from Tohoku University, Japan give Plenary Speech at conference! (Read More) ---- Jun. 19th, 2018
Welcome Assoc. Prof. Teik-Cheng Lim from Singapore University of Social Sciences, Singapore give Plenary Speech at conference! (Read More) ---- Jun. 0th, 2018
ICSMA 2019 will be held in Tokyo, Japan during January 19-22, 2019 ! Looking forward to see you again.---- May. 12th, 2018